Method of applying high pressures to a high pressure assembly

Details Method of applying high pressures to a high pressure assembly Method of applying high pressures to a high pressure assembly

2005-08-24

2009-06-02

Omgba, Essama (Department: 3726)

Metal working

Method of mechanical manufacture

Assembling or joining

C029S446000, C029S559000, C029S03300H

Reexamination Certificate

active

07540075

ABSTRACT:
An improved high pressure apparatus can include a plurality of complementary die segments. The die segments can have inner surfaces which are shaped to form a die chamber upon assembly of the die segments. A pair of anvils can be oriented such that an anvil is at each end of the die chamber. To prevent the die segments from being forced apart during movement of the anvils, force members can be connected to the die segments. The force members can apply discrete forces to the die segments sufficient to retain the die segments in substantially fixed positions relative to each other during application of force by the pair of anvils. Using such a high pressure apparatus can achieve pressures as high as 10 GPa with improved useful die life and larger reaction volumes.

REFERENCES:
patent: 2917082 (1959-12-01), von Platen
patent: 2941247 (1960-06-01), Bundy
patent: 2941248 (1960-06-01), Hall
patent: 2947610 (1960-08-01), Hall et al.
patent: 3030661 (1962-04-01), Strong
patent: 3031269 (1962-04-01), Bovenkerk
patent: 3075245 (1963-01-01), Bundy
patent: 3084388 (1963-04-01), Ballhausen
patent: 3088169 (1963-05-01), Wentorf, Jr.
patent: 3137896 (1964-06-01), Daniels
patent: 3159876 (1964-12-01), Hall
patent: 3179979 (1965-04-01), Bundy et al.
patent: 3271502 (1966-09-01), Wentorf, Jr.
patent: 3297407 (1967-01-01), Wentorf, Jr.
patent: 3332747 (1967-07-01), Bundy
patent: 3365751 (1968-01-01), Ishizuka
patent: 3423177 (1969-01-01), Bovenkerk
patent: 3488153 (1970-01-01), Bundy
patent: 3492695 (1970-02-01), Kuratomi
patent: 3517413 (1970-06-01), Takahashi
patent: 3529324 (1970-09-01), Kawai
patent: 3584336 (1971-06-01), von Platen
patent: 3674403 (1972-07-01), Jonsson
patent: 3695797 (1972-10-01), Bakul et al.
patent: 3797986 (1974-03-01), Onder
patent: 3914078 (1975-10-01), Kendall
patent: 3915605 (1975-10-01), Vereschagin et al.
patent: 4034066 (1977-07-01), Strong et al.
patent: 4042673 (1977-08-01), Strong
patent: 4081505 (1978-03-01), Kawai
patent: 4287168 (1981-09-01), Wentorf, Jr. et al.
patent: 4302168 (1981-11-01), Khvostantsev
patent: 4322396 (1982-03-01), Strong
patent: 4340576 (1982-07-01), Strong
patent: 4430051 (1984-02-01), von Platen
patent: 4547257 (1985-10-01), Iizuka et al.
patent: 4632817 (1986-12-01), Yazu et al.
patent: 4740147 (1988-04-01), Asari et al.
patent: 4797241 (1989-01-01), Peterson et al.
patent: 4836881 (1989-06-01), Satoh et al.
patent: 5273730 (1993-12-01), Yoshida et al.
patent: 5772756 (1998-06-01), Davies et al.
patent: 5980852 (1999-11-01), Burns et al.
patent: 6022206 (2000-02-01), McNutt
patent: 6159286 (2000-12-01), Sung
patent: 6336802 (2002-01-01), Hall
patent: 7128547 (2006-10-01), Sung
patent: 7186104 (2007-03-01), Hall et al.
patent: 7306441 (2007-12-01), Sung
patent: 7332727 (2008-02-01), Kawashima
patent: 7371280 (2008-05-01), Sung
patent: 2005/0150444 (2005-07-01), Sung
patent: 2005/0153010 (2005-07-01), Sung
patent: 2006/0032431 (2006-02-01), Sung
Hall, H. Tracy, “High Pressure-Temperature Apparatus,” Conference on Metallurgy at High Pressure, Chapter 4, 1964.
Sung, Chien-Min, “A Century of Progress in the Development of Very High Pressure Apparatus for Scientific Research and Diamond Synthesis,” High Temperatures—High Pressures, 1997, vol. 29, pp. 253-293.

Affiliated with

Also associated with

Rating

Method of applying high pressures to a high pressure assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of applying high pressures to a high pressure assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of applying high pressures to a high pressure assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4071503