Semiconductor module, method for manufacturing semiconductor...

Details Semiconductor module, method for manufacturing semiconductor... Semiconductor module, method for manufacturing semiconductor...

2007-10-30

2009-02-17

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

Reexamination Certificate

active

07492045

ABSTRACT:
Connection reliability in electrode portions of a semiconductor module is improved. A semiconductor wafer is prepared where a plurality of semiconductor substrates each having an electrode and a protective film at the surface is formed in a matrix shape. Next, at the surface of the semiconductor wafer (semiconductor substrate) a insulation layer is held between the semiconductor substrate and a copper sheet (metal sheet) formed integrally with a bump containing a plastic region on a tip part. With the insulating held between them, the semiconductor substrate, the insulating layer and the copper sheet are press-formed by a press machine into a single block. The bump penetrates the insulating layer, and the plastic region on the tip part is plastic deformed at a contact surface with an electrode, so that the bump and the electrode are electrically connected together.

REFERENCES:
patent: 6798062 (2004-09-01), Mamitsu et al.
patent: 6806118 (2004-10-01), Okamoto et al.
patent: 6809405 (2004-10-01), Ito et al.
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 09-289264 (1997-11-01), None
patent: 11-298143 (1999-10-01), None
patent: 2001-144206 (2001-05-01), None

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