Method of forming magnetic random access memory (MRAM)...

Details Method of forming magnetic random access memory (MRAM)... Method of forming magnetic random access memory (MRAM)...

2003-06-12

2009-02-24

Rose, Kiesha (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S003000, C438S099000, C438S458000, C438S464000

Reexamination Certificate

active

07494896

ABSTRACT:
A method of forming a magnetic memory device on a substrate includes forming the memory device on a transparent substrate coated with a decomposable material layer subject to rapid heating resulting in a predetermined high pressure, transferring the memory device to the substrate, and forming an organic transistor on the substrate prior to transfer of the magnetic memory device.

REFERENCES:
patent: 4017265 (1977-04-01), Taylor
patent: 6114088 (2000-09-01), Wolk et al.
patent: 6210479 (2001-04-01), Bojarczuk et al.
patent: 6312304 (2001-11-01), Duthaler et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6420242 (2002-07-01), Cheung et al.
patent: 6501143 (2002-12-01), Sato et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6723165 (2004-04-01), Ogawa et al.
patent: 6946178 (2005-09-01), Sheats et al.
patent: 6972204 (2005-12-01), Oohata et al.
patent: 6992869 (2006-01-01), Suzuki et al.
patent: 2000-0068418 (2000-11-01), None
Supratik Guha et al., “Transplanted Si films on arbitrary using GaN underlayers”, Applied Physics Letters, vol. 76, No. 10, Mar. 6, 2000, pp. 1264-1266.

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