Probe for inspecting one or more semiconductor chips

Details Probe for inspecting one or more semiconductor chips Probe for inspecting one or more semiconductor chips

2007-09-26

2009-08-11

Nguyen, Vinh P (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090

Reexamination Certificate

active

07573281

ABSTRACT:
A probe available for a narrow pitch pad without the need of cleaning is realized by providing a z deformed portion that is elastically deformed in a vertical direction, and a zθ deformed portion that is serially connected to the z deformed portion to rotate while being elastically deformed at least in the vertical direction. The zθ deformed portion has one or more rotation centers. The probe end has a curved surface in which the zθ deformed portion rotates about the rotation centers when coming into contact with the pad and during overdrive in the inspection, the probe end comes into contact with the pad surface at one point or within a certain range, a relative displacement occurs between the pad surface and the probe end, the contaminant material is removed in the beginning of the contact, and then electrical continuity is established in the second half of the contact.

REFERENCES:
patent: 5355080 (1994-10-01), Sato et al.
patent: 6443784 (2002-09-01), Kimoto
patent: 6504388 (2003-01-01), Comulada et al.
patent: 7432727 (2008-10-01), Kimoto
patent: 2005/0083072 (2005-04-01), Mori et al.
patent: 2005/0253607 (2005-11-01), Kimoto
patent: 2008/0174327 (2008-07-01), Kimoto
patent: 2004-274010 (2004-09-01), None
patent: 2005-300545 (2005-10-01), None

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