Semiconductor device, semiconductor integrated circuit and...

Details Semiconductor device, semiconductor integrated circuit and... Semiconductor device, semiconductor integrated circuit and...

2007-08-16

2009-12-01

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S1540PB, C257S777000

Reexamination Certificate

active

07626411

ABSTRACT:
The present invention provides a semiconductor device, including: a first semiconductor chip, and a second semiconductor chip connected to the first semiconductor chip through a plurality of bumps having not only a number of main bumps necessary for operation between the chips but also a predetermined number of measurement and control input bumps. Each of the first and second chips includes a plurality of measurement path switches individually connected to the main bumps, a plurality of current path switches connected to connecting points between the main bumps and the measurement path switches, and a control circuit for the measurement path switches, the first semiconductor chip further including a plurality of measurement and control terminals for inputting a control signal of the control circuit and supplying fixed current to be supplied to the current path switches and then measuring the voltage at the connecting points.

REFERENCES:
patent: 6833626 (2004-12-01), Kajiwara et al.
patent: 2006/0232292 (2006-10-01), Shimizume et al.
patent: 2009/0058435 (2009-03-01), Nakamura
patent: 2003-185710 (2003-07-01), None

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