AlGaN/GaN high electron mobility transistor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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Details

C257S012000, C257S200000, C257S201000, C257SE29246, C257SE29247, C257SE21403, C257SE21407

Reexamination Certificate

active

07547928

ABSTRACT:
The present invention recites a new method for manufacturing Group III-N field-effect devices, such as HEMT, MOSHFET, MISHFET devices or MESFET devices, grown by Metal-Organic Vapor Phase Expitaxy, with higher performance (power), by covering the surface with a thin SiN layer on the top AlGaN layer, in the reactor where the growth takes place at high temperature, prior cooling down the structure and loading the sample out of the reactor, as well as a method to produce some HEMT transistors on those heterostructures, by depositing the contact on the surface without any removal of the SiN layer by MOCVD. The present invention recites also a device.

REFERENCES:
patent: 5192987 (1993-03-01), Khan et al.
patent: 5445979 (1995-08-01), Hirano
patent: 2002/0096692 (2002-07-01), Nakamura et al.
patent: 2002/0167023 (2002-11-01), Chavarkar et al.
patent: 2003/0020092 (2003-01-01), Parikh et al.
patent: 2005/0173728 (2005-08-01), Saxler
patent: 2003 115487 (2003-04-01), None
patent: WO 01/13436 (2001-02-01), None
Search report dated Nov. 19, 2007 for equivalent European Patent No. 05447155.2-2203 filed Jun. 29, 2005.

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