Planar cable array

Electricity: conductors and insulators – Conduits – cables or conductors – Insulated

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Details

174268, 174117R, H01B 700

Patent

active

054498627

ABSTRACT:
This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, and which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact.
The array comprises a flat, flexible insulative substrate sheet that has a plurality of parallel conductive lines or an array of circles or polygons of which each has had insulative material surrounding or on at least two sides of the conductive lines or polygons removed in the Z axis. The insulative material is removed in such a way as to create a generally trapezoid shape having a greater length side opposite the conductor when viewed through a cross-section of the X or Y axis. This trapezoid shape allows free Z axis motion while limiting X and Y axis motion.

REFERENCES:
patent: 3547718 (1970-12-01), Gordon
patent: 3704164 (1972-11-01), Travis
patent: 4467138 (1984-08-01), Brorein
patent: 4639693 (1987-01-01), Suzuki
patent: 4716259 (1987-12-01), Tokura et al.
IBM Tech. Disclosure Bulletin, vol. 24, No. 9--Feb. 1982.

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