Lower cost semiconductor package with good thermal properties

Details Lower cost semiconductor package with good thermal properties Lower cost semiconductor package with good thermal properties

1979-03-19

1981-08-18

James, Andrew J.

357 74, 357 68, H01L 2302, H01L 2312, H01L 2348

Patent

active

042850037

ABSTRACT:
An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3190954 (1965-06-01), Pomerantz
patent: 3199000 (1965-08-01), Nippert
patent: 3399332 (1968-08-01), Savolainen
patent: 3434018 (1969-03-01), Boczar et al.
patent: 3483444 (1969-12-01), Parrish
patent: 3512050 (1970-05-01), Burton et al.
patent: 3745422 (1973-07-01), Carnes
patent: 4124864 (1978-11-01), Greenberg
patent: 4196444 (1980-04-01), Butner et al.

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