Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-02-12
2009-08-11
Hollington, Jermele M (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07573280
ABSTRACT:
A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
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Chinese Office Action dated Aug. 10, 2007, with English translation.
Hollington Jermele M
McGinn IP Law Group PLLC
NEC Electronics Corporation
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