Method for producing circuit-forming board and material for...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S830000, C029S831000, C029S832000, C029S837000, C029S846000, C156S293000, C174S265000

Reexamination Certificate

active

07624502

ABSTRACT:
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

REFERENCES:
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 5413838 (1995-05-01), Azuma et al.
patent: 5519177 (1996-05-01), Wang et al.
patent: 5652042 (1997-07-01), Kawakita et al.
patent: 5689879 (1997-11-01), Urasaki et al.
patent: 5741575 (1998-04-01), Asai et al.
patent: 5779870 (1998-07-01), Seip
patent: 5960538 (1999-10-01), Kawakita et al.
patent: 6010768 (2000-01-01), Yasue et al.
patent: 6085414 (2000-07-01), Swarbrick et al.
patent: 6139777 (2000-10-01), Omoya et al.
patent: 6217988 (2001-04-01), Yasue et al.
patent: 6239777 (2001-05-01), Sugahara et al.
patent: 6248428 (2001-06-01), Asai et al.
patent: 6504705 (2003-01-01), Shimada et al.
patent: 2003/0039811 (2003-02-01), Sugawa et al.
patent: 6-209148 (1994-07-01), None
patent: 6-268345 (1994-09-01), None
patent: 7-115280 (1995-05-01), None
patent: 9-46041 (1997-02-01), None
patent: 11-251703 (1999-09-01), None
patent: 2002-368043 (2002-12-01), None
patent: 2003-209355 (2003-07-01), None
Supplementary European Search Report issuedApr. 9, 2008in a European Application that is a foreign counterpart of the present application.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing circuit-forming board and material for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing circuit-forming board and material for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing circuit-forming board and material for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4065814

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.