Light emitting diode package having multi-stepped reflecting...

Details Light emitting diode package having multi-stepped reflecting... Light emitting diode package having multi-stepped reflecting...

2007-04-13

2009-06-16

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S093000, C257S098000

Reexamination Certificate

active

07547923

ABSTRACT:
A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

REFERENCES:
patent: 7029156 (2006-04-01), Suehiro et al.
patent: 7268014 (2007-09-01), Lee et al.

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