Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-02-27
2009-02-10
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S691000, C257SE23043
Reexamination Certificate
active
07489023
ABSTRACT:
A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.
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Cao Phat X
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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