Method of forming a conductive through hole for a...

Details Method of forming a conductive through hole for a... Method of forming a conductive through hole for a...

2006-09-06

2009-02-03

Vo, Peter (Department: 3729)

Metal working

Piezoelectric device making

C029S830000, C029S831000, C029S832000, C029S852000, C310S31300R

Reexamination Certificate

active

07484279

ABSTRACT:
In a method of forming a part of a through-hole for a piezoelectric substrate having an excitation electrode and a leading electrode which are formed on a first surface of the piezoelectric substrate and are made of a thin metal film in order to establish a conductivity, the method includes: blasting a position on a second surface of the piezoelectric substrate corresponding to the leading electrode to form a preliminary hole by boring the piezoelectric substrate in its halfway; etching a bottom of the preliminary hole to form a part of a through-hole through which a part of the leading electrode is exposed; and placing a conductive material in the part of a through-hole, the conductive material contacting the leading electrode from a side of the second surface of the piezoelectric substrate.

REFERENCES:
patent: 3887887 (1975-06-01), Wagers et al.
patent: 5907768 (1999-05-01), Malta et al.
patent: 6276992 (2001-08-01), Houda et al.
patent: 6310422 (2001-10-01), Satoh et al.
patent: 7173324 (2007-02-01), Lee et al.
patent: 2007/0117245 (2007-05-01), Lee et al.
patent: A 8-213874 (1996-08-01), None
patent: 09162670 (1997-06-01), None
patent: A 2006-174311 (2006-06-01), None
patent: 2005/0032158 (2005-04-01), None

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