Silicon-containing polyamic acid derivative and photosensitive r

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522164, 528 25, 528 26, 528 35, 430270, 430283, 430906, G03F 7075, C08G 7310, C08G 7706, C08L 7706

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054497051

ABSTRACT:
The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) ##STR1## and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30.degree. C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): ##EQU1## A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.

REFERENCES:
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patent: 3950308 (1976-04-01), Greber et al.
patent: 5055549 (1991-10-01), Maeda et al.
patent: 5071908 (1991-12-01), Kunimune et al.
patent: 5187241 (1993-02-01), Buchwalter et al.
Buhr et al, "Non-Ionic Photoacid Generating Compounds", Polymeric Materials: Science and Engineering, vol. 61, pp. 269-277, 1989.

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