Semiconductor package having an optical device and the...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257S088000, C257S432000, C257S433000, C257SE25032, C257S680000

Reexamination Certificate

active

07485899

ABSTRACT:
A semiconductor package having an optical device and the method of making the same, includes a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted. Also, only one transparent substrate is used in the semiconductor package.

REFERENCES:
patent: 5734156 (1998-03-01), Dahlin et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6621616 (2003-09-01), Bauer et al.
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2005/0087757 (2005-04-01), Erchak et al.
patent: 2005/0161756 (2005-07-01), Sun et al.
patent: 2005/0236684 (2005-10-01), Chen et al.

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