Method of reducing process steps in metal line protective...

Details Method of reducing process steps in metal line protective... Method of reducing process steps in metal line protective...

2005-05-16

2009-02-24

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S739000, C257S758000, C257S762000, C257S773000, C257S774000, C257S776000, C257SE23020, C257SE23173, C257SE23174

Reexamination Certificate

active

07495335

ABSTRACT:
A method of forming a protective structure on a top metal line on an interconnect structure is disclosed. The method includes providing a plate opening in the passivation layer on the top metal line and forming a protective plate in the plate opening on the top metal line.

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patent: 6897570 (2005-05-01), Nakajima et al.
patent: 2001/0008311 (2001-07-01), Harada et al.

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