System and method to increase die stand-off height

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S118000, C438S612000

Reexamination Certificate

active

07598124

ABSTRACT:
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.

REFERENCES:
patent: 5633535 (1997-05-01), Chao et al.
patent: 6649444 (2003-11-01), Earnworth et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method to increase die stand-off height does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method to increase die stand-off height, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method to increase die stand-off height will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4054741

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.