Printed circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S260000

Reexamination Certificate

active

07572983

ABSTRACT:
A printed circuit board includes a plurality of pairs of first bond pads mounted on an area of a surface thereof, and a plurality of pairs of second bond pads mounted to on the same area thereof. One first bond pad of each pair is electrically connected to a first signal wire. The other first bond pad of each pair is electrically connected to a second signal wire. One second bond pad of each pair is connected to a first bond pad of one pair that are connected with the first signal wire. The other second bond pad of each pair is connected to a first bond pad of another pair that is connected with the second signal wire.

REFERENCES:
patent: 5128832 (1992-07-01), Lawrence
patent: 5303122 (1994-04-01), Adams, Jr. et al.
patent: 5406458 (1995-04-01), Schutt
patent: 5425647 (1995-06-01), Mencik et al.
patent: 5453581 (1995-09-01), Liebman et al.
patent: 5729439 (1998-03-01), Saito
patent: 5805428 (1998-09-01), Singer
patent: 7223921 (2007-05-01), Rissing et al.

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