Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-22
2009-06-16
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S715000, C174S015200, C165S104210, C165S080400, C165S185000
Reexamination Certificate
active
07548426
ABSTRACT:
A heat dissipation device includes a base (14) for absorbing heat from an electronic device and a plurality of fins (20) arranged on the base. A heat pipe (32) thermally contacts the fins and the base for transferring heat from the base to the fins. The heat pipe includes a U-shaped section thermally mounted below the base for absorbing the heat from the electronic device, two straight sections thermally engaging with the fins, and two arced sections interconnecting the U-shaped section and corresponding straight sections. The heat pipe is integrally formed by bending a straight heat pipe and functions as two U-shaped, individual heat pipes.
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Chervinsky Boris L
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Niranjan Frank R.
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