Production method of semiconductor chip

Details Production method of semiconductor chip Production method of semiconductor chip

2004-10-20

2008-11-18

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000, C257SE21499

Reexamination Certificate

active

07452752

ABSTRACT:
Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting support; and optionally removing the adhesive layer from the semiconductor chips.

REFERENCES:
patent: 4818323 (1989-04-01), d'Aragona et al.
patent: 4848323 (1989-07-01), Marijnissen et al.
patent: 5414297 (1995-05-01), Morita et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 6214520 (2001-04-01), Wolk et al.
patent: 6235141 (2001-05-01), Feldman et al.
patent: 6284425 (2001-09-01), Staral et al.
patent: 6358664 (2002-03-01), Nirmal et al.
patent: 6551906 (2003-04-01), Oka
patent: 6620649 (2003-09-01), Uchida
patent: 6792991 (2004-09-01), Thallner
patent: 6939741 (2005-09-01), Fukuoka et al.
patent: 7201969 (2007-04-01), Miyakawa et al.
patent: 7226812 (2007-06-01), Lu et al.
patent: 2001/0018404 (2001-08-01), Oshima et al.
patent: 2004/0185639 (2004-09-01), Fukuoka et al.
patent: 2004/0259332 (2004-12-01), Fukuoka et al.
patent: 1255522 (2000-06-01), None
patent: 100 51 938 (2002-02-01), None
patent: 0 571 649 (1993-12-01), None
patent: 0 976 802 (2000-02-01), None
patent: 0 977 254 (2000-02-01), None
patent: 1 167 483 (2002-01-01), None
patent: 1 229 388 (2002-08-01), None
patent: 63-30581 (1988-02-01), None
patent: 05-335411 (1993-12-01), None
patent: 06-132432 (1994-05-01), None
patent: 6-302569 (1994-10-01), None
patent: 7-145357 (1995-06-01), None
patent: 11-026404 (1999-01-01), None
patent: 11-283279 (1999-10-01), None
patent: 2000-038556 (2000-02-01), None
patent: 2000-040677 (2000-02-01), None
patent: 2000-195826 (2000-07-01), None
patent: 2002-353170 (2002-12-01), None
patent: WO 01/35457 (2001-05-01), None
patent: WO 03/017363 (2003-02-01), None
patent: WO 03/060972 (2003-07-01), None
patent: WO 03/085714 (2003-10-01), None

Affiliated with

Also associated with

Rating

Production method of semiconductor chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Production method of semiconductor chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Production method of semiconductor chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4051655