Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2005-05-09
2008-11-25
Wojciechowicz, Edward (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S684000, C257S704000, C439S075000, C439S090000
Reexamination Certificate
active
07456483
ABSTRACT:
A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions.
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Certification.
Fujita Kazuya
Tsukamoto Hiroaki
Yasudome Takashi
Conlin David G.
Daley, Jr. William J.
Edwards Angell Palmer & & Dodge LLP
Sharp Kabushiki Kaisha
Wojciechowicz Edward
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