Method of evaluating film thickness, method of detecting...

Details Method of evaluating film thickness, method of detecting... Method of evaluating film thickness, method of detecting...

2005-02-11

2008-11-04

Stafira, Michael P (Department: 2886)

Optics: measuring and testing

Dimension

Thickness

Reexamination Certificate

active

07446889

ABSTRACT:
A method of evaluating a thickness of a film during a polishing process includes the steps of irradiating light onto a surface of the film during the polishing process; obtaining a differential signal of reflection spectra at a polishing time t and a polishing time t−Δt with a time difference Δt from the polishing time t; and analyzing the differential signal to obtain a thickness d of the film at the polishing time t.

REFERENCES:
patent: 6580508 (2003-06-01), Chen et al.
patent: 2002/0127951 (2002-09-01), Ishikawa et al.
patent: 2006/0166606 (2006-07-01), Kobayashi et al.
patent: 2000-183001 (2000-06-01), None
patent: 2000-186917 (2000-07-01), None
patent: 2000-186918 (2000-07-01), None

Affiliated with

Also associated with

Rating

Method of evaluating film thickness, method of detecting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of evaluating film thickness, method of detecting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of evaluating film thickness, method of detecting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4049385