Method of sealing semiconductor element mounted on...

Details Method of sealing semiconductor element mounted on... Method of sealing semiconductor element mounted on...

2006-11-07

2008-11-18

Gulakowski, Randy (Department: 1796)

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

C528S031000, C528S032000, C528S033000, C528S037000, C528S040000, C528S041000

Reexamination Certificate

active

07452571

ABSTRACT:
Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

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“Electronic Materials”, vol. 44, No. 9, Sep. 2005, (published by K.K. Kogyo Chosakai Publishing, Inc.), pp. 90 to 93, 112, cover sheet and translation of relevant part of p. 91, left col., lines 1-8.

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