Method of forming a platinum pattern

Details Method of forming a platinum pattern Method of forming a platinum pattern

2006-07-26

2008-12-30

Tran, Binh X (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C252S079100

Reexamination Certificate

active

07470623

ABSTRACT:
A solution for platinum chemical mechanical polishing is disclosed. Further, a method for forming Pt patterns is disclosed which utilizes the disclosed Pt-CMP solution which contains an alkali aqueous solution and an oxidizer which improves the polishing rate and polishing characteristics of Pt which forms a lower electrode of a metal capacitor.

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Notice of Rejection from Korean Intellectual Property Office dated Jun. 30, 2004, with English translation (4 pages).
“Method for Planarizing Semiconductor Integrated Circuit and Chemical Mechanical Polishing Slurry Therefor”, Kazuo et al., Jan. 26, 2001, English translation by computer of JP 2001023940, 11 pages.
Semiconductor Integrated Circuit Flattening . . . Measurement of Exposed Layers, Kazuo et al., Jan. 26, 2001, English Abstract (Derwent) of JP 2001023940, 2 pages.

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