Radiant energy – Photocells; circuits and apparatus – Housings
Reexamination Certificate
2005-03-15
2008-11-18
Le, Que T (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Housings
C250S227210
Reexamination Certificate
active
07453058
ABSTRACT:
The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface. The at least one optical bump is configured to couple light between the at least one second optically active area and the at least one first optically active area.
REFERENCES:
patent: 4058821 (1977-11-01), Miyoshi et al.
patent: 4143385 (1979-03-01), Miyoshi et al.
patent: 4268113 (1981-05-01), Noel, Jr.
patent: 4650277 (1987-03-01), Husher et al.
patent: 6259840 (2001-07-01), Munoz-Bustamante et al.
patent: 6773169 (2004-08-01), Ebeling et al.
patent: 6987906 (2006-01-01), Nakama et al.
patent: 7111992 (2006-09-01), Kaneko
Lee Michael G.
Yokouchi Kishio
Baker & Botts L.L.P.
Fujitsu Limited
Le Que T
LandOfFree
Optical bumps for low-loss interconnection between a device... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical bumps for low-loss interconnection between a device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical bumps for low-loss interconnection between a device... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4048727