Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2007-08-10
2008-12-02
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S458000, C438S459000, C438S475000, C438S558000, C257SE21482, C257SE21568
Reexamination Certificate
active
07459375
ABSTRACT:
A method of fabricating a silicon-on-plastic layer via layer transfer includes depositing a layer of SiGe on a silicon substrate; depositing a layer of silicon; implanting splitting hydrogen ions into the silicon substrate; bonding a glass substrate to the silicon layer; splitting the wafer; removing the silicon layer and a portion of the SiGe layer; depositing a dielectric on the silicon side of the silicon-on-glass wafer; applying adhesive and bonding a plastic substrate to the silicon side of the silicon-on-glass wafer; removing the glass from the glass side of the bonded, silicon-on-glass wafer to form a silicon-on-plastic wafer; and completing a desired IC device on the silicon-on-plastic. Multi-level structure may be fabricated according to the method of the invention by repeating the last few steps of the method of the invention.
REFERENCES:
patent: 6486008 (2002-11-01), Lee
patent: 6534380 (2003-03-01), Yamauchi et al.
patent: 2003/0186521 (2003-10-01), Kub et al.
patent: 2005/0140283 (2005-06-01), Lau et al.
patent: 2006/0197096 (2006-09-01), Kerdiles et al.
patent: 2006/0205180 (2006-09-01), Henley et al.
patent: 2008/0057675 (2008-03-01), Henley et al.
Hsu Sheng Teng
Lee Jong-Jan
Maa Jer-Shen
Tweet Douglas J.
Law Office of Gerald Maliszewski
Lebentritt Michael S
Maliszewski Gerald
Sharp Laboratories of America Inc.
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