Preparation of flexible copper foil/polyimide laminate

Details Preparation of flexible copper foil/polyimide laminate Preparation of flexible copper foil/polyimide laminate

2005-08-02

2008-12-02

Crispino, Richard (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S233000, C156S237000, C156S331100, C428S458000

Reexamination Certificate

active

07459047

ABSTRACT:
A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.

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