Semiconductor package and semiconductor device

Details Semiconductor package and semiconductor device Semiconductor package and semiconductor device

1996-11-04

1999-06-15

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257778, 257779, H01L 2348

Patent

active

059125055

ABSTRACT:
A semiconductor package and a semiconductor device comprises a metal bump to be placed between a metal pad formed on a package body of a substantially plate-like shape and an interconnecting solder for connecting a metal ball thereto, wherein the melting point of the metal bump is higher than that of the interconnecting solder, thereby enhancing a fatigue resistance against temperature fluctuations as well as improving a reliability around the interconnecting portion.

REFERENCES:
patent: 5147084 (1992-09-01), Behun et al.
patent: 5591941 (1997-01-01), Acocella et al.

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