Method for manufacturing a circuit board by a direct electrostat

Metal working – Method of mechanical manufacture – Electrical device making

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101DIG13, H05K 310

Patent

active

046989072

ABSTRACT:
A process for the manufacture of circuitry in the form generally known as circuit boards comprises the manufacture of a master pattern from a conductive layer and a superposed non-conductive layer which can receive an electrical charge. The master pattern is contacted by a developer containing a conductive material in the form of powder or ink which transfers the conductive material to the pattern layers on the master pattern by electrostatic force. A non-conductive substrate is then brought to a position closely adjacent to the master pattern and electrostatic forces used to transfer the particles from the master pattern onto the substrate in the required pattern. The particles are then fixed by heating. Multiple layer circuits can be built up using nonconductive layers. A coating can be applied to the conductive particles to enable them to accept an electrostatic charge, the coating being dissipated during the heat fixing.

REFERENCES:
patent: 3054692 (1962-09-01), Newman et al.
patent: 3108893 (1963-10-01), Oliphant
patent: 3120806 (1964-02-01), Supernowicz
patent: 3574614 (1971-04-01), Carreira
patent: 3828670 (1974-08-01), Kennedy
patent: 3862848 (1975-01-01), Marley

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