Upper heat insulating cylinder for manufacturing...

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0579885

CLAIM:
The ornamental design for an upper heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

REFERENCES:
patent: 5534074 (1996-07-01), Koons
patent: D404375 (1999-01-01), Shimazu
patent: D405428 (1999-02-01), Ishii
patent: 6033215 (2000-03-01), Ohsawa
patent: 6171400 (2001-01-01), Wingo
patent: 2002/0092815 (2002-07-01), Kim et al.
patent: 2004/0069732 (2004-04-01), Huang et al.
patent: 2005/0145584 (2005-07-01), Buckley et al.

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