Method and apparatus for thermal dissipation in an...

Details Method and apparatus for thermal dissipation in an... Method and apparatus for thermal dissipation in an...

2008-03-21

2008-12-16

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000

Reexamination Certificate

active

07466551

ABSTRACT:
A thermal dissipation apparatus includes a primary heat sink. The primary heat sink includes a first base member including a component coupling surface and a secondary heat sink coupling surface, and a plurality of fins extending from the first base member. A secondary heat sink may be provided such that the primary heat sink is operable to provide thermal dissipation in a low profile form factor chassis while the secondary heat sink may be coupled with the primary heat sink to provide more optimal thermal dissipation in a high profile form factor chassis.

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