Ceramic substrate grid structure for the creation of virtual...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S350000, C174S397000, C174S260000, C174S261000, C174S262000, C361S816000, C361S818000, C361S790000, C361S791000, C361S792000, C361S793000, C361S794000, C361S795000

Reexamination Certificate

active

07465882

ABSTRACT:
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.

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