Indented structure for encapsulated devices and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S774000, C257S783000, C257S618000, C257S622000, C257SE21499

Reexamination Certificate

active

07462931

ABSTRACT:
A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation features. The indentation features increase the surface area of the getter material, thereby increasing the volume of gas that the getter material can absorb. This may improve the vacuum maintained within the vacuum cavity over the lifetime of the vacuum encapsulated device.

REFERENCES:
patent: 4312669 (1982-01-01), Boffito et al.
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5961750 (1999-10-01), Boffito et al.
patent: 6004450 (1999-12-01), Northrup et al.
patent: 6822880 (2004-11-01), Kovacs et al.
patent: 6853067 (2005-02-01), Cohn et al.
patent: 6897469 (2005-05-01), Syllaios et al.
patent: 6923625 (2005-08-01), Sparks
patent: 6988924 (2006-01-01), Ramamoorthi et al.
patent: 2006/0083896 (2006-04-01), McKinnell et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Indented structure for encapsulated devices and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Indented structure for encapsulated devices and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Indented structure for encapsulated devices and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4038400

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.