Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

Filed on

2005-11-18

Date issued

2008-11-18

Examiner

Smith, Zandra (Department: 2822)

Patent Class

Semiconductor device manufacturing: process

SubClass

Packaging or treatment of packaged semiconductor

SubSubClass

Assembly of plural semiconductive substrates each possessing...

Other Related Categories

C438S107000, C438S108000, C257S621000, C257S686000, C257SE21002

Type

Reexamination Certificate

Status

active

Patent number

07452751

Description

ABSTRACT:
Semiconductor device includes a pair of substrates (1, 2) disposed oppositely, semiconductor elements (5, 6) formed in the substrates (1, 2), respectively, and having semiconductor circuits (3, 4) and electrodes (7, 8), respectively, a wiring conductor (9) interposed between the electrodes (7, 8), and a through electrode (12) extending through one substrate (1) and connected to the electrode (7) via the wiring conductor (9). The other substrate (2) is disposed laterally of the through electrode (12). Surface of the through electrode (12) projecting from the one substrate (1) and lateral surface of the element (6) are coated with an insulation material (13). The through electrode (12) has one end exposed in a back surface of the one substrate (1), while other end is positioned flush with a back surface of the other substrate (2), being exposed.

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