Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-05-02
2008-12-16
Graybill, David E (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S701000, C257S723000, C257S725000, C257S773000, C257SE23004, C257SE23065, C257SE23067, C257SE23069, C257SE23178
Reexamination Certificate
active
07466021
ABSTRACT:
Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.
REFERENCES:
patent: 6121679 (2000-09-01), Luvara et al.
patent: 7014472 (2006-03-01), Fjelstad et al.
patent: 2005/0093152 (2005-05-01), Fjelstad et al.
patent: 2008/0143707 (2008-06-01), Mitchell
Graybill David E
Interconnect Portfolio, LLP
Shea, Esq. Ronald R.
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