Semiconductor device package, method of manufacturing the...

Details Semiconductor device package, method of manufacturing the... Semiconductor device package, method of manufacturing the...

2006-02-15

2008-11-18

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S698000, C257S737000, C257S774000, C438S106000, C438S121000, C438S613000, C438S637000, C438S639000, C438S640000

Reexamination Certificate

active

07453141

ABSTRACT:
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.

REFERENCES:
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5825084 (1998-10-01), Lau et al.
patent: 6005289 (1999-12-01), Watanabe et al.
patent: 6232551 (2001-05-01), Chang
patent: 2001/0038905 (2001-11-01), Takada et al.
patent: 102 01 782 (2003-03-01), None
patent: 4-348591 (1992-12-01), None
patent: 10-92972 (1998-04-01), None

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