Measuring and testing – Fluid pressure gauge – Diaphragm
Reexamination Certificate
2006-11-22
2008-11-18
Thompson, Jewel V (Department: 2855)
Measuring and testing
Fluid pressure gauge
Diaphragm
Reexamination Certificate
active
07451653
ABSTRACT:
A pressure sensor for measuring an external pressure fabricated upon a ceramic substrate penetrated by a via extending from the top to the bottom of the ceramic substrate is disclosed. A sacrificial layer is deposited on a portion of the top of the ceramic substrate in communication with a via. A diaphragm material is then deposited on the sacrificial layer, thereby creating a diaphragm surface. A sensor element for transducing a mechanical deflection into an electrical signal is applied to the diaphragm surface. When the sacrificial layer is removed, the diaphragm is able to deflect in response to the external pressure, which is sensed by the sensor element in order to measure the external pressure.
REFERENCES:
patent: 4425829 (1984-01-01), Kranik et al.
patent: 4774626 (1988-09-01), Charboneau et al.
patent: 5242641 (1993-09-01), Horner et al.
M. Fonseca, J. English, M. Von Arx, M. Allen, “Wireless Micromachined Ceramic Pressure Sensor for High-Temperature Applications”, Journal of Microelectromechanical Systems, 2002, pp. 337-343, vol. 11, No. 4.
J. English, M. Allen, “Wireless Micromachined Ceramic Pressure Sensors”, Proceedings of the Twelfth IEEE Microelectromechanical Systems Conference, 1999, pp. 511-516, Orlando, Florida.
M. Zarnick, D. Belavic, K. Friedel, A. Wymyslowski, “A Procedure for Validating the Finite Element Model of a Piezoresistive Ceramic Pressure Sensor”, IEEE Transactions on Components and Packaging Technologies, Dec. 2004, pp. 668-675, vol. 27, No. 4.
A. Wymyslowski, M. Santo-Zarnick, K. Friedel, D. Belavic, “Numerical Simulation and Experimental Verification of the Piezoresistivity for the Printed Thick-Film Piezoresistors”, Fifth International Conference on Thermal and Mechanical Simulation and Experiments in MEMS, 2004, pp. 359-366.
DuPont Microcircuit Materials Green Tape Design and Layout Guide, 2001.
DuPont Microcircuit Materials 3554 Strain Gauge Resistor Data Sheet, 2003.
C. Canali, D. Malavasi, B. Morten, M. Prudenziati, A. Taroni, “Strain Sensitivity in Thick-film Resistors”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980, pp. 421-423, vol. CHMT-3, No. 3.
M. Lefort, V. Djafari, B. Jouffrey, C. Savary, “Thick Film Piezoresistive Ink: Application to Pressure Sensors”, The International Journal of Microcircuits and Electronic Packaging, 2000, pp. 191-202, vol. 23, No. 2.
D. Kerns, Jr., W. Kang, A. Al-Ali, “Piezoresistive Effects in Thick Film Resistors for Strain Sensing Applications”, SoutheastCon, 1989, pp. 348-350, Columbia, South Carolina.
DuPont Microcircuit Materials Green Tape Design and Layout Guide—LTCC Process, 2004.
C. B. Sippola, C. H. Ahn, “A Ceramic Sealed Cavity with Screen Printed Ceramic Diaphragm”, Ceramic Interconnect Technology Conference, 2004, pp. 179-182, Denver, CO.
Thompson Jewel V
Thompson Hine LLP
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