Method for manufacturing printing plate

Details Method for manufacturing printing plate Method for manufacturing printing plate

2006-05-02

2008-11-04

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C216S051000, C216S083000, C438S745000, C430S300000, C430S302000

Reexamination Certificate

active

07445724

ABSTRACT:
A method for manufacturing a printing plate to acheive a precise and fine pattern by minimizing a variation of etching critical dimension is disclosed. The method uses a hard mask having an opening on an insulating substrate to form a first trench having a first depth in the insulating substrate. A first etching stopper and a first photoresist may be applied on a surface of the insulating substrate including the first trench for patterning the first photoresist by exposing the first photoresist. Likewise, a second and third trench may be formed.

REFERENCES:
patent: 6190988 (2001-02-01), Furukawa et al.
patent: 2003/0060037 (2003-03-01), Wu
patent: 2004/0178170 (2004-09-01), Morimoto
patent: 2005/0158987 (2005-07-01), Choi
patent: 2007/0015093 (2007-01-01), Yoo et al.
Office Action issued in corresponding Chinese Patent Application No. 2006100903121; issued May 9, 2008.

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