Comparing identifying indicia formed using laser marking...

Details Comparing identifying indicia formed using laser marking... Comparing identifying indicia formed using laser marking...

2003-05-19

2008-11-18

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C438S015000, C438S106000, C438S127000, C427S208200, C347S176000

Reexamination Certificate

active

07452732

ABSTRACT:
A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser-reactive marking material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes the laser-reactive marking material to fuse to the surface of the chip, creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface and the remaining residue on the non-irradiated portion can be readily removed.

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