Thermal activation device

Details Thermal activation device Thermal activation device

2005-02-09

2008-12-02

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S380900, C156S499000

Reexamination Certificate

active

07458407

ABSTRACT:
A thermal activation device has a thermal head and a platen roller that is in contact with an upwardly inclined surface of the thermal head and that is rotationally driven to convey a heat-sensitive adhesive sheet along the upwardly inclined surface between the thermal head and the platen roller while the thermal head thermally activates a heat-sensitive adhesive layer of the heat-sensitive adhesive sheet. A discharge roller is positioned downstream of the platen roller with a part of an outer circumference of the discharge roller above the level at which the heat-sensitive adhesive sheet exits from between the thermal head and the platen roller. The discharge roller is rotationally driven to convey the heat-sensitive adhesive sheet on the outer circumference of the discharge roller to a discharge port. A discharge guide is positioned above the discharge roller, and spaced from the discharge roller a distance larger than a thickness of the heat-sensitive adhesive sheet, to guide the heat-sensitive adhesive sheet onto the discharge roller. The discharge roller is configured such that a part of the roller outer circumference thereof is offset by 0.3 mm or more to the platen roller side from a reference plane obtained by extending a head surface of the thermal head.

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Patent Abstracts of Japan vol. 2000, No. 19, Jun. 5, 2001 & JP 2001 048139 A (Teraoka Seiko Co Ltd), Feb. 20, 2001.

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