System, method and apparatus for improved...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S042000, C385S044000, C385S049000, C385S050000, C385S088000, C438S027000, C438S029000, C438S041000, C257S722000, C257S726000, C257S728000, C257SE23010, C257SE23101

Reexamination Certificate

active

07457491

ABSTRACT:
The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122or124) of a layer (114, 116or118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

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