Method and apparatus for bump inspection

Details Method and apparatus for bump inspection Method and apparatus for bump inspection

2006-05-23

2008-12-30

Lauchman, L. G. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

C356S237600, C356S606000

Reexamination Certificate

active

07471381

ABSTRACT:
A method of dynamically imaging, calibrating and measuring bump height and coplanarity of a plurality of bumps on a surface is disclosed. The method includes illuminating the plurality of bumps with multispectral light from at least one light source, and receiving light of a first wavelength at an imaging device such that a top view image of at least a portion of the plurality of bumps is captured. The light of the first wavelength is reflected off the plurality of bumps at a first angle from the surface. Light of a second wavelength is received at the imaging device such that at least one oblique side view image of at least a portion of the plurality of bumps is captured. The light of the second wavelength is reflected off the plurality of bumps at a second angle from the surface. The captured images are processed to determine absolute bump height and coplanarity. A corresponding apparatus is also disclosed.

REFERENCES:
patent: 7075662 (2006-07-01), Hallerman et al.
patent: 2005/0110987 (2005-05-01), Furman et al.
patent: 06-317407 (1994-11-01), None
patent: 11-287628 (1999-10-01), None
patent: 11-287628 (1999-10-01), None
patent: 2000-258354 (2000-09-01), None
patent: 2000-356510 (2000-12-01), None
Patent Abstracts of Japan 2000-258354 (Sep. 22, 2000).
Patent Abstracts of Japan 2000-356510 (Dec. 26, 2000).
Patent Abstracts of Japan 11-287628 (Oct. 19, 1999).
Patent Abstracts of Japan 06-317407 (Nov. 15, 1994).

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