Thermosetting resin and thiocyanato-containing...

Details Thermosetting resin and thiocyanato-containing... Thermosetting resin and thiocyanato-containing...

Filed on

2002-10-29

Date issued

2008-11-04

Examiner

Sellers, Robert (Department: 1796)

Patent Class

Synthetic resins or natural rubbers -- part of the class 520 ser

SubClass

Synthetic resins

SubSubClass

Processes of preparing a desired or intentional composition...

Other Related Categories

C428S413000, C428S414000, C428S416000, C428S418000, C428S426000, C428S429000, C428S430000, C428S435000, C428S436000, C428S447000, C428S448000, C428S450000, C428S457000, C428S458000, C428S460000, C428S473500, C428S480000, C428S524000, C428S688000, C524S262000, C524S588000, C524S592000, C524S593000, C524S594000, C524S597000, C524S601000, C524S606000, C524S612000

Type

Reexamination Certificate

Status

active

Patent number

07446137

Description

ABSTRACT:
A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1is an alkylene or alkyleneoxyalkylene group, R2and R3are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

REFERENCES:
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patent: 4524169 (1985-06-01), Wolff et al.
patent: 5219963 (1993-06-01), Goerl et al.
patent: 6172157 (2001-01-01), Araki et al.
patent: 6867319 (2005-03-01), Wakita
patent: 2259303 (1993-03-01), None
patent: 63-309566 (1988-12-01), None
patent: 63309566 (1988-12-01), None
patent: 2-185585 (1990-07-01), None
patent: 02185585 (1990-07-01), None
patent: 4-277534 (1992-10-01), None
patent: 5-214171 (1993-08-01), None
Hawley's Condensed Chemical Dictionary, Van Nostrand Reinhold Company, New York, New York, 1971, p. 865.
Derwent accession No. 1992-235284 for Japanese Patent No. 4-277534, Goerl et al., Oct. 2, 1992, one page.
Derwent accesion No. 1993-078992 for Japanese Patent No. 5-214171, Gorl et al., Aug. 24, 1993, one page.

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