Thin film transistor, integrated circuit, liquid crystal...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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Details

C438S142000, C257SE27100, C257SE29117

Reexamination Certificate

active

07456038

ABSTRACT:
A method of producing a thin film transistor comprises irradiating a resist on a glass base plate with a ray from a light source through a mask and, thereafter, developing the resist to form contact holes, using an i-ray as the ray.

REFERENCES:
patent: 5691115 (1997-11-01), Okamoto et al.
patent: 2004/0234900 (2004-11-01), Schroeder
patent: 2006/0170836 (2006-08-01), Kondo et al.
patent: 1567068 (2008-08-01), None
patent: 2003-234285 (2003-08-01), None
“Ultrafine Machining Technique” issued Feb. 25, 1997, by Ohmsha.
Machine translation (furnished by the Chinese Patent Office website) of Reference BB.
Jul. 11, 2008 Office action issued against Chinese Patent Application No. 200610071921.2 which corresponds to U.S. Appl. No. 11/397,925.

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