Electronic circuit device and manufacturing method of the same

Details Electronic circuit device and manufacturing method of the same Electronic circuit device and manufacturing method of the same

2006-04-21

2008-12-02

Paumen, Gary F. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Within distinct housing spaced from panel circuit arrangement

C439S736000

Reexamination Certificate

active

07458823

ABSTRACT:
A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

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