Wafer bonding method

Details Wafer bonding method Wafer bonding method

2005-03-29

2008-12-30

Le, Thao P. (Department: 2818)

Electrical connectors

Contact comprising cutter

Insulation cutter

Reexamination Certificate

active

07470142

ABSTRACT:
A method of coupling substrates together includes steps of providing first and second substrates. The second substrate includes a conductive bonding region positioned on its surface. Heat is provided to the conductive bonding region to reduce its number of defects. The surface of the conductive bonding region is bonded to the first substrate so that the conductive bonding region and the first substrate are coupled together.

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