Bow control in an electronic package

Details Bow control in an electronic package Bow control in an electronic package

2006-07-13

2008-12-16

Nguyen, Dao H (Department: 2818)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S098000, C428S195100, C438S121000, C438S637000, C438S926000, C438S928000, C257S691000, C257SE23144, C257SE23149, C257SE23193, C174S262000, C174S357000, C174S657000, C174S663000

Reexamination Certificate

active

07465488

ABSTRACT:
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate. Various embodiments include a method comprising providing a substrate including a layer having an outer surface, depositing a metal layer on the outer surface, and etching the metal layer to form an opening, the opening enclosing an area on the outer surface to mount one or more dice.

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