Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-06-14
2008-11-18
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S149000, C438S455000, C438S459000, C438S464000, C257S696000, C257S777000, C257SE21568, C257SE21569, C257SE23064
Reexamination Certificate
active
07452786
ABSTRACT:
Application form of and demand for an IC chip formed with a silicon wafer are expected to increase, and further reduction in cost is required. An object of the invention is to provide a structure of an IC chip and a process capable of producing at a lower cost. A feature of the invention is to use a metal film and a reactant having the metal film as a separation layer. An etching rate of the metal film or the reactant having metal is high, and a physical means in addition to a chemical means of etching the metal film or the reactant having metal can be used in the invention. Thus, the IDF chip can be manufactured more simply and easily in a short time.
REFERENCES:
patent: 7091070 (2006-08-01), Imai et al.
patent: 2001/0015256 (2001-08-01), Yamazaki et al.
patent: 2001/0053559 (2001-12-01), Nagao et al.
patent: 2003/0022403 (2003-01-01), Shimoda et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2004/0087110 (2004-05-01), Takayama et al.
patent: 2004/0256618 (2004-12-01), Imai et al.
patent: 2005/0148121 (2005-07-01), Yamazaki et al.
patent: 1 193 759 (2002-04-01), None
patent: 2001-260580 (2001-09-01), None
patent: 2001-272923 (2001-10-01), None
patent: 2003-203898 (2003-07-01), None
patent: WO 03/010825 (2003-02-01), None
patent: WO 2005/057658 (2005-06-01), None
International Search Report dated Mar. 15, 2005 for PCT/JP2004/018978 filed Dec. 14, 2004.
Written Opinion dated Mar. 15, 2005 for PCT/JP2004/018978 filed Dec. 14, 2004.
International Search Report dated Mar. 22, 2005 for PCT/JP2005/001541 filed Jan. 27, 2005.
Written Opinion dated Mar. 22, 2005 for PCT/JP2005/001541 filed Jan. 27, 2005.
“Sense of Crisis” is a trigger. Ignited Evolution of a Sesame-Grain Sized Chip, Leading Trends, Nikkei Electronics, Nov. 18, 2002, p. 67-76.
Dairiki Koji
Dozen Yoshitaka
Tamura Tomoko
Tsurume Takuya
Nguyen Dao H
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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