Heat pipe type heat dissipation device

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104210, C165S080300, C165S185000, C361S700000

Reexamination Certificate

active

07448438

ABSTRACT:
A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.

REFERENCES:
patent: 5699853 (1997-12-01), Goth et al.
patent: 6382306 (2002-05-01), Hsu
patent: 6796373 (2004-09-01), Li
patent: 6938682 (2005-09-01), Chen et al.
patent: 7021368 (2006-04-01), Lin et al.
patent: 7051792 (2006-05-01), Lee et al.
patent: 2004/0226697 (2004-11-01), Liu
patent: 2005/0092465 (2005-05-01), Lin et al.
patent: 2005/0103476 (2005-05-01), Chen et al.
patent: 2005/0141198 (2005-06-01), Lee et al.
patent: M248225 (2004-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat pipe type heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pipe type heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pipe type heat dissipation device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4029280

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.