Multi-chip semiconductor device package

Details Multi-chip semiconductor device package Multi-chip semiconductor device package

2006-10-16

2008-12-16

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE23037, C257SE23052

Reexamination Certificate

active

07466024

ABSTRACT:
A semiconductor device comprises a microcomputer chip, an SDRAM which is disposed alongside the microcomputer chip and is thinner than the microcomputer chip, a tub, a plurality of inner leads and outer leads, first wires that connect pads of the microcomputer chip and pads of the SDRAM, and second wires which connect the pads of the microcomputer chip and the inner leads and which are disposed so as to bridge over the SDRAM and are formed with loops at positions higher than loops of the first wires. An interface circuit for a memory bus is connected only between the chips, without connecting to external terminals, and is closed within a package. Therefore, pins can be utilized for other functions correspondingly and a multi-pin configuration can be achieved. Further, the cost of an SIP (semiconductor device) can be reduced owing to the adoption of a frame type.

REFERENCES:
patent: 5352632 (1994-10-01), Sawaya
patent: 5781047 (1998-07-01), Shreve et al.
patent: 6300146 (2001-10-01), Thierry
patent: 6602735 (2003-08-01), Shu
patent: 6638790 (2003-10-01), Minamio et al.
patent: 6768186 (2004-07-01), Letterman et al.
patent: 2003/0102556 (2003-06-01), Moriguchi et al.
patent: 06-151685 (1994-05-01), None
patent: 09-160802 (1997-06-01), None
patent: 10-123212 (1998-05-01), None

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